Global Semiconductor Packaging Materials Market 2016-2020
Description-
Semiconductor
packages are metal, plastic, and ceramic components which not only
protect the fabricated IC on the semiconductor die but also acts as
an interconnect between the die and the PCB (printed circuit board).
They protect the die from external mechanical impact and corrosion,
and also act as electrically conductive interconnects with excellent
signal propagation properties. Excess heat in the circuit is not
allowed to build up by dissipation through attached heat spreaders.
Packaging components vary in dimensions and functionality and mainly
are organic substrates, leadframes, bonding wires, encapsulation
resins, die attach materials, solder balls, and thermal interface
materials, among others. The key customers of these packaging
material are fabless semiconductor companies, packaging material
suppliers, packaging subcontractors, semiconductor manufacturers, the
electronics industry, and the automotive sector.
To
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Technavios
analysts forecast the global semiconductor packaging materials market
to grow at a CAGR of 4.79% during the period 2016-2020.
Covered
in this report
The
report covers the present scenario and the growth prospects of the
global semiconductor packaging materials market for the period
2016-2020. To calculate the market size and geographical
segmentation, the report considers the revenue generated from the
sales of different types of packaging based on the type of material,
which can be broadly classified as either leadframe based or laminate
substrate based.
The
market is divided into the following segments based on geography:
Americas
APAC
EMEA
Technavio's
report, Global Semiconductor Packaging Materials Market 2016-2020,
has been prepared based on an in-depth market analysis with inputs
from industry experts. The report covers the market landscape and its
growth prospects over the coming years. The report also includes a
discussion of the key vendors operating in this market.
Key
vendors
Amkor
Technology
DuPont
Henkel
Hitachi
Chemical
Honeywell
KYOCERA
Toppan
Printing
Other
prominent vendors
Alpha
Advanced Materials
Applied
Materials
ASM
Pacific Technology (ASMPT)
BASF
Beijing
Doublink Solders
Beijing
Kehua New Chemical Technology
Cheil
Industries
Duksan
Hi-metal
Diehl
Metall
Dynacraft
Evergreen
Semiconductor Materials
Guangdong
Rongtai
Heesung
Metal
Heraeus
Ibiden
Indium
IQE
KCC
LG
Innotek
Lintec
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